Project Audit: Integrated Technical and Financial Audit

We provide differentiated service of Integrated Technical and Financial Audit of Greenfield Fab/ OSAT projects across all phases (Quarterly and Annual level)

Technical Audit is conducted by multi decade experienced semiconductor industry Fab/OSAT leadership (Subject Matter Experts across Site Area Planning , Site Resource Planning, Construction, New Equipment, Used Equipment Appraisal, Manufacturing Process, Productization, High Volume Operations)

Financial Audit component is informed granularly via Technical Audit which is conducted by leading Statuary Auditors / Chartered Accountants experts from the local Fab / OSAT region Accounting Standards (all applicable laws) who are uniquely trained in Semiconductor industry complexity.

Our Integrated Technical and Financial Audit program serve as one-stop instrument for:

CHIPS incentive/subsidy execution from the government side to provide granular Expenditure Utilization Audits (Technical and Financial)
Loans / grant / debt utilization and enablement for supporting Financial institution, share holder, equity partners
Internal Project Audits to inform and ensure compliance with overall Project Cost and Company Budgetary Allocation/Planning

We have curated team for specific Greenfield project categories including the following:

Fab (Logic, Memory, Analog, Compound Semiconductor, Discreet, Display (LCD, LED, OLED))
OSAT / ATP / ATMP (covering all packaging architectures from legacy Wirebonding to 2.5D/3D heterogeneous integration like CoWoS, SoIC, EmiB, Foveros, SAINT enabled by TCB and Hybrid bonding technologies)
EMS