Project Cost Estimation: Project Resource Planning and Cost Estimation
We provide differentiated service of granular planning across different phases of Greenfield Fab/OSAT projects including:
- Multi year Project Planning
- Project Resource Planning
- Total Project Cost Estimation
We provide Integrated Technical and Financial planning of Greenfield Fab/ OSAT projects across all phases (Quarterly and Annual level)
Technical Program planning is delivered by multi decade experienced semiconductor industry Fab/OSAT leadership (Subject Matter Experts across Site Area Planning , Site Resource Planning, Construction, New Equipment, Used Equipment Appraisal, Manufacturing Process, Productization, High Volume Operations)
Financial Program planning is informed granularly via Technical planning and associated current/forecasted databases (industry leading capability) of corresponding Capex cost structures.
We offer granular capability of Total Project Cost Estimation (via Digital Twin of planned Fab/OSAT) across all Capex and Opex cost structures involved through different phases of the Greenfield project.
Competitive Fab Economics
We also offer the differentiated service of providing Fab TCO (Total Cost of Ownership) across all Capex and Opex cost structures in different world regions for the same Fab via region specific site level cost benchmarking and Digital Twin simulations comprehending region specific variables, cost and subsidies / tax incentives. Thus allowing for TCO optimization to enable site selection for Fab projects and/or translation of Fab project cost from one world region to another.
Our Competitive Fab Economics capability is used across all major world regions by public and private players as gold standard for Project Cost. (Similar Competitive OSAT Economics capability available for OSAT projects)
Our Integrated Technical and Financial Program program serve as one-stop instrument for:
- CHIPS incentive / subsidy execution from the government side to enable Technical and Financial due diligence of Project leading to total subsidy / grant / loan allocation
- Loans / grant / debt securing enablement fro. supporting Financial institution, share holder, equity partners
- Internal Project Planning to inform and ensure compliance with overall Project Cost and Company Budgetary Allocation/Planning
We have curated team for specific Greenfield project categories including the following:
- Fab (Logic, Memory, Analog, Compound Semiconductor, Discreet, Display (LCD, LED, OLED))
- OSAT / ATP / ATMP (covering all packaging architectures from legacy Wirebonding to 2.5D/3D heterogeneous integration like CoWoS, SoIC, EmiB, Foveros, SAINT enabled by TCB and Hybrid bonding technologies)
- EMS and Components level Assembly
